quality Bicheng Newly shipped PCB & Rogers PCB Board factory

With the second half of the year approaching, we have received inquiries from some clients regarding our work schedule. To help you better plan your orders and coordinate shipping arrangements, we are pleased to share our holiday schedule for the remainder of 2026 through the 2027 Spring Festival.   Below are our upcoming non-working days:     Holiday Dates Days Off Dragon Boat Festival June 19 – June 21, 2026 3 days Mid-Autumn Festival September 25 – September 27, 2026 3 days National Day October 1 – October 7, 2026 7 days 2027 Spring Festival (Chinese New Year) February 2 – February 13, 2027 12 days   Important Notes: National Day: October 1 – 7, with make-up working days on September 20 (Sunday) and October 10 (Saturday). 2027 Spring Festival: We will be closed from February 2 to February 13, 2027, for a total of 12 days. Please plan your orders in advance to ensure timely delivery before the holiday.   We will also send individual reminders prior to each holiday to confirm specific shipping deadlines. Should you have any questions, please do not hesitate to contact us.   Best regards, Bicheng Team

Recently, Japanese semiconductor materials supplier Sumitomo Bakelite announced a price increase for its "epoxy molding compound (EMC) for semiconductor devices."   The price increase covers all grades of Sumitomo Bakelite's EMC for packaging, with increases ranging from 10% to 20%, effective June 1, 2026. Sumitomo Bakelite holds approximately 40% of the global market share in semiconductor EMC, with products covering both traditional and advanced packaging needs, applicable to automotive electronics, industrial modules, and data centers.   Regarding the reason for the price adjustment, Sumitomo Bakelite stated that the recent situation in the Middle East has led to increased procurement costs for raw materials used in its EMC. Furthermore, rising costs for packaging materials, energy, and transportation have further increased the overall product cost. This is not the first time EMC prices have increased. In early April, Kumho Petrochemical of South Korea and Mitsubishi Chemical of Japan issued price increase notices for engineering plastics such as EMC, with increases ranging from a minimum of 5% to a maximum of 20%. Epoxy resin film plastics are thermosetting molding compounds made by compounding epoxy resin as a matrix with curing agents, inorganic fillers, and various additives.   They are widely used in the semiconductor packaging field to protect chips from external environmental influences and provide electrical insulation and heat dissipation. The price surge in epoxy resin molding compounds ultimately stems from supply disruptions to raw materials such as resin. According to Nikkei, the closure of the Strait of Hormuz has led to severe supply shortages of methanol, xylene, and related solvents, with prices rising by at least 40% since March. These solvents are essential raw materials for the production of various specialty resins.   The rising prices of resins and their raw materials are impacting all aspects of the semiconductor and PCB industry chain: an executive at a chip substrate supplier stated that Mitsubishi Gas Chemical has already raised the prices of some products by 20% in the first quarter of this year. He added that given the overall rising material costs, CCL prices are expected to rise further.   Huafu Securities points out that electronic resin, as the core substrate of copper-clad laminates, is crucial in determining the signal transmission efficiency and reliability of the board. Its industry chain extends from upstream resin synthesis through prepreg processing to downstream PCB conduction. Against the backdrop of explosive growth in AI computing power, computing chips are demanding signal transmission speeds exceeding 224Gbps, forcing PCB materials to leap from traditional FR-4 to M8, M9, and even higher-level high-frequency, high-speed copper-clad laminates. The core driving force lies in the iterative upgrades of resin systems. Affected by escalating geopolitical conflicts in the Middle East and disruptions to shipping through the Strait of Hormuz, costs across the petrochemical industry chain have risen across the board, leading to significant increases in the prices of various commodities. The upstream suppliers of core CCL materials such as epoxy resin and PPO resin are also largely petrochemical companies. With raw material costs continuing to rise, price increases are expected to intensify.       =================================================================================== Copyright statement: The copyright of the information in this article belongs to the original author and does not represent the views of this platform. It is for sharing only. If there are copyright and information errors involved, please contact us to correct or delete it. Thanks!

Industry executives warn of soaring costs for resins, copper, and glass fiber, impacting everything from smartphones to AI servers.   The ongoing conflict in the Middle East is severely disrupting the supply of key raw materials, driving up the prices of printed circuit boards (PCBs) used in nearly all electronic devices — from smartphones and computers to advanced AI servers, according to industry executives and insiders. This new disruption adds further pressure on electronics manufacturers already grappling with soaring memory chip costs. It also highlights the widening impact of the conflict, which has already disrupted global supply chains, plastics, and oil supplies. In early April, an attack on a petrochemical complex in Jubail, Saudi Arabia, halted the production of high-purity Polyphenylene Ether (PPE) resin — a critical base material for manufacturing PCB laminates. According to a source, Saudi Basic Industries Corporation (SABIC), which supplies approximately 70% of the world’s high-purity PPE, operates the Jubail facility. Production has yet to resume, causing a severe global supply shortage of the material. The conflict has also significantly disrupted shipping routes in the Gulf region. PCB prices had already been climbing since late last year, driven by growing demand for AI servers. Three industry insiders say that demand has accelerated sharply since March, as manufacturers scramble to secure raw material supplies and mitigate cost surges. In a recent report, Goldman Sachs analysts noted that PCB prices jumped 40% in April alone compared to March. They added that cloud service providers are accepting further price increases, anticipating that demand will outpace supply for the foreseeable future. According to a recent report by Prismark, the global PCB industry is expected to grow by 12.5% to reach $95.8 billion by 2026. An executive at Daeduck Electronics — a South Korean PCB manufacturer whose clients include Samsung Electronics, SK Hynix, and AMD — told Reuters that the company has begun discussing price increases with customers. Speaking on condition of anonymity due to the sensitivity of the matter, the executive said his focus has now shifted from meeting clients to communicating with suppliers, as lead times for chemical materials like epoxy resin have extended from 3 weeks to as long as 15 weeks. The sharp rise in PCB prices is also due to shortages of other key materials, including fiberglass and copper foil. According to one source, copper foil prices have surged as much as 30% this year, with the acceleration picking up in March. Copper accounts for approximately 60% of the total raw material cost of PCB manufacturing, according to Shenzhen Hongxin Electronics Technology, a major Chinese PCB supplier to Nvidia. The Chinese company warned earlier this month that the Middle East conflict could drive up prices for key materials, including resin and copper. According to Shenzhen Hongxin, a standard multi-layer PCB now costs approximately 1,394 yuan per square meter, while high-end models used for AI servers cost around 13,475 yuan per square meter. Bicheng is a leading provider of custom PCB solutions. We closely monitor global supply chain trends to help our customers navigate market challenges and deliver high-quality, reliable boards for every application. Visit our website to learn more about our custom PCB services and current lead times.     =================================================================================== Copyright statement: The copyright of the information in this article belongs to the original author and does not represent the views of this platform. It is for sharing only. If there are copyright and information errors involved, please contact us to correct or delete it. Thanks!  

How much do you know about copper clad laminate (CCL)? Let me explain.   Copper clad laminate (CCL) is the core substrate for PCBs, with downstream applications in communications, computers, automotive, industrial, and medical fields. Its upstream suppliers include raw materials such as copper foil, resin, and glass fiber, while its downstream suppliers include PCB manufacturers and end-use electronic product manufacturers. This industry is highly cyclical and is entering a new growth cycle, driven by emerging demands such as 5G, AI servers, and automotive electronics.     CCL is a sheet material made by hot-pressing a reinforcing material impregnated with resin, coated on one or both sides with copper foil, and then hot-pressed. It fulfills the three main functions of conducting electricity, insulating, and supporting printed circuit boards, making it a core material for PCB manufacturing.     The CCL industry chain has a clear three-tier structure: upstream raw material supply (copper foil, glass fiber cloth, resin, filler, etc.), midstream CCL manufacturing, and downstream PCB applications.     The three core raw materials for CCL are copper foil, resin, and glass fiber cloth, accounting for 42%, 26%, and 19% of the cost, respectively, for a total of 87%.   If you require additional substrates, please feel free to contact us! Bicheng Company specializes in providing high-frequency circuit boards and raw materials.  

On July 8, the PCB concept was hot. According to Prismark statistics, the global PCB output value is expected to grow to US$94.7 billion in 2029. The CAGR from 2024 to 2029 will reach 5.2%; the PCB output value of the Chinese market will reach US$49.7 billion in 2029.     In addition, in 2025, the capital expenditure of cloud factories such as Microsoft and Google will increase by more than 30% year-on-year. The capital expenditure of China's Alibaba and Tencent is expected to exceed 120 billion/80 billion yuan, and the demand for AI infrastructure will drive the accelerated expansion of the production capacity of underlying materials such as PCB.     The AI-driven technological innovation upcycle will last longer and generate greater market demand. China's PCB industry continues to upgrade and expand mid-to-high-end production capacity and deploy overseas production capacity, and its performance release is sustainable.     The overall demand for downstream electronics is currently showing a recovery trend, coupled with the continued upward momentum in innovative fields represented by AI and high-speed communications, which together support the growth in overall PCB demand. With the iteration of AI hardware performance, PCB will be further upgraded to higher specifications in terms of product technology and materials. Relying on its early technological accumulation and improved product competitiveness, Bicheng Technology has gradually improved its industry position in the high-end market, and its AI PCB supply share has continued to increase. Bicheng is expected to achieve rapid development by seizing the opportunities of AI development.       =================================================================================== Copyright statement: The copyright of the information in this article belongs to the original author and does not represent the views of this platform. It is for sharing only. If there are copyright and information errors involved, please contact us to correct or delete it. Thanks!

A 2-Layer Wangling TP440 High-Frequency PCB for Miniaturized Antenna Applications     Introduction In the world of RF and microwave design, material selection is arguably the most critical decision an engineer can make. For applications demanding specific dielectric constants, exceptional stability, and reliability in harsh environments, standard FR-4 materials simply won't suffice. This case study examines a custom PCB built on Wangling TP440 material, a unique high-frequency thermoplastic with a dielectric constant (Dk) of 4.4, designed for demanding antenna applications. This board illustrates the capabilities of the TP series, particularly its ability to enable circuit miniaturization without sacrificing performance.     Project Overview & Technical Specifications This project involved the design of a compact, 2-layer rigid PCB measuring 67.5mm x 58.6mm. The board is characterized by its minimalist design, featuring only 11 components, 19 pads, and a single net, underscoring the highly specialized nature of its function. The design's simplicity is a testament to the efficiency of the chosen material; the inherent properties of the TP440 core allow for a straightforward, yet high-performance circuit.     The full construction details are as follows: Base Material: Wangling TP440 (a ceramic-filled Polyphenylene Oxide resin composite) . Layer Count: 2-layer rigid PCB. Board Dimensions: 67.5mm x 58.6mm, +/- 0.15mm. Minimum Trace/Space: 6/8 mils. Minimum Hole Size: 0.3mm. Blind Vias: No. Finished Board Thickness: 0.6mm. Finished Cu Weight: 1oz (35 μm) outer layers . Via Plating Thickness: 20 μm. Surface Finish: Immersion Gold (ENIG). Silkscreen & Solder Mask: None. Quality Standard: IPC-Class-2. 100% Electrical Test: Used prior to shipment .     The Core Material: Wangling TP440 The PCB's performance hinges on its core material, Wangling TP440. This material is part of a unique series of high-frequency thermoplastics that set it apart from conventional PCB substrates. Unlike standard materials reinforced with fiberglass, TP440's dielectric layer is composed of a precise blend of ceramics and PPO resin .     The defining feature of the Wangling TP series is its tunable dielectric constant (Dk) . By adjusting the ratio of ceramic to PPO resin, the Dk can be customized within a range of 3 to 25 . The TP440 variant is specified to have a Dk of 4.4 ± 0.09 and a low dissipation factor (Df) of 0.0010 at 10 GHz, ensuring minimal signal loss at high frequencies . This precise, stable Dk and ultra-low loss are crucial for applications where signal integrity is paramount .     Key Advantages for Demanding Applications The choice of TP440 material for this PCB was driven by several key requirements typical of advanced antenna systems:   Miniaturization: For a given frequency, the physical size of a circuit element like a patch antenna is inversely proportional to the square root of the dielectric constant . A higher Dk allows for a significantly smaller antenna design. The TP440's Dk of 4.4 enables a more compact form factor compared to standard materials (like FR-4 with a Dk of ~4.3-4.5) while maintaining superior high-frequency performance.     High-Frequency Stability: The TP material maintains its low dielectric loss across a wide frequency range, up to and beyond 10 GHz. This stability is essential for consistent performance in applications like GPS, satellite communications, and other RF systems .     Environmental Resilience: The board is designed for reliability in extreme environments. The TP440 material boasts a long-term operating range from -100°C to +150°C, making it suitable for aerospace, military, and other outdoor applications. It is also resistant to radiation and exhibits low outgassing, a critical property for vacuum environments .     Superior Machinability: While offering performance comparable to, or better than, fragile ceramic substrates, TP material is much easier to machine. It can be processed using standard methods like drilling, etching, and shearing, avoiding the costly and complex handling required for ceramics .     Design for Manufacturing (DFM) and Reliability This PCB was fabricated with stringent quality control measures. The manufacturing process adhered to the IPC-Class-2 standard, ensuring high reliability in commercial and industrial environments. The decision to omit solder masks and silkscreens is likely to prevent any disruption to the high-frequency signal path or for size constraints, a common practice in minimalist RF designs. The use of Immersion Gold (ENIG) surface finish provides a flat, solderable surface with excellent corrosion resistance and low contact resistance, ideal for RF applications. To guarantee functionality, the board underwent a 100% electrical test before shipment .     Conclusion This custom PCB design is a prime example of how leveraging advanced materials like Wangling TP440 enables engineers to push the boundaries of high-frequency circuit design. By utilizing a material with a stable, low-loss dielectric constant and extreme environmental resilience, this compact PCB is primed for use in critical applications such as GPS antennas, Beidou navigation systems, missile-borne electronics, and miniaturized antennas . The success of this project highlights the importance of selecting the right substrate to meet the unique challenges of RF and microwave engineering.  

Thick, Tough, and Low Loss: The WL-CT440 30mil PCB Need a high-frequency board that's thicker than usual but still easy to fabricate? Meet the WL-CT440 30mil ENIG PCB. This 2-layer board (89mm x 63.5mm) is built on Wangling's WL-CT440—a thermosetting hydrocarbon-ceramic composite that bridges the gap between PTFE performance and FR-4 processability.   Why you want it: FR-4 Friendly: Unlike finicky PTFE materials, WL-CT440 processes using standard FR-4 fabrication techniques. No special via prep. Lower cost, faster turnaround. Solid RF Performance: Dielectric constant of 4.1 and dissipation factor of 0.004 at 10 GHz. Plenty for microwave and antenna work. Thick Core: At 0.8mm (30mil) finished thickness, this board offers mechanical rigidity that thinner RF laminates can't match. Stable as a Rock: TCDK of -21 ppm/°C means your Dk won't drift with temperature. CTE closely matched to copper (X: 14ppm, Y: 18ppm). No Mask, No Silkscreen: Just bare laminate, copper, and ENIG. Clean and simple.   The Specs Snapshot: Stackup: 2-Layer | 35µm copper / 0.762mm (30mil) WL-CT440 / 35µm copper Finish: Immersion Gold (ENIG) Traces/Holes: 4/6 mil trace/space | 0.2mm min hole size (tight!) Stats: 37 components, 49 pads, 31 vias Quality: IPC-Class-2 | 100% electrical test   Key Properties: Thermal Conductivity: 0.66 W/m/K (good heat dissipation) Moisture Absorption: 0.12% (low) High Tg: >280°C   Best For: Aerospace equipment, airborne radar, phased array antennas, satellite communication, power amplifiers, and navigation systems.   The Bottom Line: If you want PTFE-like RF performance without PTFE's fabrication headaches, the WL-CT440 delivers. It's thick, stable, low loss, and processes just like FR-4. A smart choice for aerospace and microwave applications.

The TLX-9 PCB – 10 mil, EPIG (Nickel-Free) for High-Frequency Dominance In the world of RF and microwave engineering, the substrate is not just a physical holder for copper—it is the heart of the signal integrity game. When you need tight dielectric control, minimal signal loss, and a surface finish that won't ruin your impedance, you stop looking at standard FR-4. Enter the TLX-9 PCB (10mil, EPIG Nickle-Free) . This is a 2-layer rigid board designed for applications where moisture absorption and dielectric constant (DK) stability are non-negotiable. Let’s break down the specs, the stackup, and why this matters for your next LNA, antenna, or high-power amplifier.   The Foundation: Taconic TLX-9 The star of this build is the TLX-9 laminate. This is a PTFE/woven glass composite. Unlike standard RF materials that drift with temperature or humidity, TLX-9 is a workhorse. Dielectric Constant (DK): 2.5 @ 10 GHz (tightly controlled across frequency/temp) Dissipation Factor (Df): 0.0019 @ 10 GHz Moisture Absorption:

  Need to shrink your RF circuit without sacrificing performance? Meet the RT/duroid 6006 10mil Immersion Silver PCB.   This 2-layer board (134.8mm x 78.65mm) is built for engineers who want size reduction and low loss—especially at X-band frequencies and below.   Why you want it: High Dk, Smaller Circuits: With a dielectric constant of 6.15, this ceramic-PTFE material lets you shrink patch antennas and satellite comms modules significantly. Very Low Loss: Dissipation factor is just 0.0027 at 10 GHz. Your signal stays clean. No Solder Mask, No Silkscreen: This is a barebones, high-performance RF board. Top and bottom masks are "no"—just bare laminate and Immersion Silver pads. Tough as Nails: Td > 500°C and only 0.05% moisture absorption. This board survives harsh environments.   The Specs Snapshot: Stackup: 2-Layer | 35µm copper / 0.254mm (10mil) RT/duroid 6006 / 35µm copper Finish: Immersion Silver (flat, solderable, low loss) Traces/Holes: 5/6 mil trace/space | 0.3mm min hole size Stats: 46 components, 64 pads, 41 vias   Best For: Patch antennas, satellite systems, power amplifiers, and radar warning systems.   The Bottom Line: If you need high dielectric constant to cut board space, but refuse to give up low loss and thermal stability, the RT/duroid 6006 is your answer. No frills (mask/silkscreen), just pure RF performance.

Why the RO4350B LoPro 4mil Immersion Gold PCB is a Game-Changer for RF & High-Speed Designs     Introduction In the world of high-frequency circuitry, material selection is everything. Standard FR-4 often falls short at gigahertz frequencies, causing excessive signal loss and thermal headaches. Enter the RO4350B LoPro PCB.   We recently got our hands on a specification sheet for a specific 2-layer variant (4mil thick with Immersion Gold finish), and it ticks all the boxes for demanding RF, microwave, and high-speed digital applications. Here is a deep dive into why this particular board—with its 78mm x 101mm footprint—is built to perform.     1. The Core: Rogers RO4350B Low Profile The hero here is the substrate. Unlike standard RO4350B, this uses Low Profile (LoPro) copper foil technology. Rogers has essentially reverse-treated the foil to bond better with the dielectric. The result? Lower conductor loss, which translates directly to improved insertion loss and signal integrity.   If you are designing circuits above 40 GHz, standard laminates create a bottleneck. The LoPro technology keeps your signal clean and powerful.     Key Stats at 10 GHz/23°C: Dielectric Constant (Dk): 3.48 ± 0.05 (Stable frequency performance) Dissipation Factor (Df): 0.0037 (Very low loss)     2. The Build: Ultra-Thin, Ultra-Rugged At just 0.2mm (4mil) finished thickness, this board is incredibly thin. But don't let its stature fool you; this is a thermally tough board. Stackup: Copper (35μm) | RO4350B LoPro (0.102mm) | Copper (35μm) Thermal Conductivity: 0.69 W/mK (Much higher than FR-4, pulling heat away from hot spots efficiently). High Temperature Stability: Tg > 280°C and Td > 390°C. This board survives lead-free soldering reflow cycles without breaking a sweat.     3. The Finish: Immersion Gold (ENIG) Why Immersion Gold over HASL or bare copper? For a board this precise, ENIG is mandatory. Flatness: With a 4mil thickness and fine traces (5/6 mils), you need a perfectly planar surface for soldering small components. Corrosion Resistance: Gold protects the underlying nickel from oxidation. Wire Bonding: It allows for aluminum wire bonding if needed.     4. Design & Manufacturing Details This specific design is a 2-layer rigid board with some tight tolerances that prove the manufacturing capability: Minimum Trace/Space: 5/6 mils (Standard for complex RF routing). Minimum Hole Size: 0.25mm (Roughly 10mils). Vias: 26 vias, 0.25mm minimum, with a 20 μm copper plating thickness. Note the absence of blind vias—this keeps fabrication costs lower while utilizing the full 2-layer stack. Solder Mask: Blue on top, none on the bottom. Silkscreen: White on top only. The Layout Stats: 24 Components 49 Total Pads (31 Thru-hole, 18 Top SMT) 2 Nets (Very clean layout).     5. The "Why": Benefits for Your Application Why spec this specific board over a standard RF board?   A. Lower Insertion Loss Because of the LoPro foil and RO4350B dielectric, you can push operating frequencies beyond 40 GHz without the signal attenuation seen in standard materials.   B. Reduced PIM (Passive Inter-modulation) If you are building base station antennas, PIM is the enemy. The RO4350B system inherently reduces unwanted signal mixing.   C. Thermal Reliability The Z-axis Coefficient of Thermal Expansion (CTE) is 32 ppm/°C—closely matched to copper (17 ppm/°C). This means your plated through holes won't crack under thermal cycling.   D. Standard FR-4 Processing Even though this is a high-performance Rogers board, it doesn't require nasty "sodium etch" via preparation. It fabricates using standard epoxy/glass (FR-4) processes, saving you money and lead time.     6. Ideal Applications Based on the data, this board is built for the intersection of digital and RF: High-Speed Digital: Servers, routers, and high-speed backplanes (where signal integrity is king). Telecom Infrastructure: Cellular base station antennas and power amplifiers. Satellite Systems: LNBs for direct broadcast satellites. IoT & RFID: RFID tags requiring high frequency accuracy.     The Verdict The RO4350B LoPro 4mil Immersion Gold PCB is a professional-grade solution for engineers who refuse to compromise. It combines the electrical performance of a high-end RF laminate with the manufacturability of an FR-4 board.   With 100% electrical testing prior to shipment and compliance with IPC-Class-2 standards, this specific 78x101mm board is ready for worldwide deployment.   Need a reliable 2-layer RF board? This is your benchmark.