With the rapid development of electronic technology, PCB aluminum substrate, as a plate with excellent heat dissipation properties, has been widely used in the electronics industry. PCB aluminum substrate is a metal-based material plate with good thermal conductivity, electrical insulation and mechanical processing performance. Due to its unique structure and excellent performance, aluminum substrates have excellent performance in many fields.
This article will introduce the types of PCB aluminum substrates in detail to help everyone better understand and choose suitable aluminum substrates.
I. Classification according to substrate
1. Pure aluminum base plate
Pure aluminum substrate is the most common type of aluminum substrate, which is composed of pure aluminum plate and insulation layer. Pure aluminum plates have good thermal conductivity and mechanical strength, while the insulation layer ensures the safety and stability of the circuit. Pure aluminum substrates are suitable for most electronic products, especially when higher thermal dissipation performance is required.
2. Copper and aluminum composite substrates
Copper-aluminum composite substrate is a substrate made of copper and aluminum. Copper has good electrical and thermal conductivity, while aluminum is lightweight and resistant to corrosion. Copper-aluminum composite substrate combines the advantages of two metals, has excellent heat dissipation performance and electrical performance, and is suitable for high-performance electronic products.
3. Stainless steel aluminum base board
The stainless steel aluminum substrate uses stainless steel as the base material and is covered with an aluminum plate on the surface. The two are closely combined through a special process. The stainless steel aluminum substrate has high mechanical strength and corrosion resistance, while maintaining good heat dissipation properties of the aluminum substrate. This kind of substrate is suitable for electronic equipment in harsh environments.
II. Classified according to production technology
1. Copper-plated aluminum base plate
Copper-plated aluminum substrate is a copper film covered on the surface of the aluminum plate by electroplating or electroless plating. The copper film has good electrical and thermal conductivity and can improve the electrical and heat dissipation properties of the aluminum substrate. Copper-plated aluminum substrates are suitable for high-frequency circuits and high-precision circuits.
2. Spray-coating aluminum substrate
Sprayed aluminum substrate is a substrate formed by spraying a layer of insulating material on the surface of the aluminum plate. The spraying process can make the substrate surface flatter and improve the stability and reliability of the circuit. Sprayed aluminum substrates are suitable for electronic products with general requirements.
3. Pressed aluminum substrate
Laminated aluminum substrate is a substrate formed by laminating aluminum plates and insulating materials together through high temperature and high pressure. The laminating process can improve the structural strength and electrical performance of aluminum substrates. Press-laminated aluminum substrates are suitable for electronic products that require high mechanical strength and electrical performance.
III. Classified according to usage
1. Power aluminum base board
Power aluminum substrates are mainly designed for high-power electronic devices, such as power supplies, motor drivers, etc. This type of substrate needs to withstand large currents and temperatures, so thicker aluminum plates and high-quality insulating materials are usually used. The power aluminum substrate has good heat dissipation performance and electrical performance, ensuring stable operation of the equipment under high load.
2. High frequency aluminum base plate
High-frequency aluminum substrate is mainly used in high-frequency circuits, such as wireless communications, radar and other equipment. Such substrates need to have good electrical and thermal conductivity to reduce signal loss and improve heat dissipation. High-frequency aluminum substrates are usually made of high-conductivity metal materials and high-performance insulating materials.
3. Precision aluminum base plate
Precision aluminum substrates are mainly used for high-precision electronic equipment, such as instruments, sensors, etc. This type of substrate has higher requirements on dimensional accuracy, flatness and stability. Precision aluminum substrates usually use high-precision manufacturing processes and high-quality raw materials to ensure equipment performance and reliability.
4. Special aluminum base plate
Special aluminum substrates are mainly designed for special environments and application needs, such as aerospace, military and other fields. Such substrates need to have extremely high reliability, durability and environmental adaptability. Special aluminum substrates usually use special materials and unique manufacturing processes to meet the use requirements in extreme environments.
IV. Classified by structure
1. Single layer aluminum base plate
The single-layer aluminum substrate is composed of a layer of aluminum plate and a layer of insulating material, with a simple structure and low cost. It is suitable for occasions where there are certain requirements on cost and low requirements on electrical performance.
2. Double-layer aluminum base plate
The double-layer aluminum substrate is composed of two layers of aluminum plates and a layer of insulating material, which has good heat dissipation performance and mechanical strength. The double-layer structure can reduce electromagnetic interference and improve signal transmission stability. Double-layer aluminum substrates are suitable for electronic equipment with high requirements on electrical performance and heat dissipation.
3. Multilayer Aluminum Substrate
Multi-layer aluminum substrates are composed of multiple layers of aluminum plates and insulating materials alternately superimposed. The structure is complex and the cost is high. Multi-layer construction further improves thermal and electrical performance while reducing electromagnetic interference. Multilayer aluminum substrates are suitable for high-performance, high-precision electronic devices.
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