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Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications

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Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications

MOQ:	1
Price:	USD 2.99-9.99 PER PIECE
Standard Packaging:	Vacuum
Delivery Period:	10 working days
Payment Method:	T/T, Western Union
Supply Capacity:	45000 pieces per month

Detail Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng Technologies Limited

Certification

Model Number

BIC-507-V0.62

Number Of Layers:

Glass Epoxy::

IT-180ATC

Final Foil:

1.0 Oz

Final Height Of PCB::

1.6 Mm ±10%

Surface Finish:

Immersion Gold

Solder Mask Color::

Green

Colour Of Component Legend:

White

Test:

100% Electrical Test Prior Shipment

Minimum Order Quantity:

Price:

USD 2.99-9.99 PER PIECE

Packaging Details:

Vacuum

Delivery Time:

10 working days

Payment Terms:

T/T, Western Union

Supply Ability:

45000 pieces per month

Product Description

Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

This is a type of standard double sided high temperature PCB which is built on ITEQ’s IT-180ATC laminate. (For more details about IT-180ATC, please refer to High Tg Lead Free Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS with 0.5oz-3oz Copper 0.5-3.2mm Thick). There are 10 boards paneled up in the array. They are 1.6mm thick with 2oz copper, coating with immersion gold on pads and green solder mask protection for substrate. 25 pieces are vacuum packed for shipment.

Applications

Automotive (Engine room ECU)

Backplanes

Data Storage

Server and Networking

Telecommunications

Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications 0

PCB Parameters

Item	Description	Requirement		Actual		Result
1. Laminate	Material Type	FR-4 IT-180ATC		FR-4 IT-180ATC		ACC
	Tg	170	℃	170	℃	ACC
	Supplier	ITEQ		ITEQ		ACC
	Thickness	1.6	±10% mm	1.63-1.68	mm	ACC
2.Plating thickness	Hole Wall	≥25	µm	26.51	µm	ACC
	Outer copper	35	µm	41.09	µm	ACC
	Inner Copper
3.Solder mask	Material Type	TAIYO/ PSR-2000GT600D		TAIYO/ PSR-2000GT600D		ACC
	Color	Green		Green		ACC
	Rigidity (Pencil Test)	≥4H or above		5H		ACC
	S/M Thickness	≥10	µm	20.11	µm	ACC
	Location	Both Sides		Both Sides		ACC
4. Component Mark	Material Type	TAIYO/ IJR-4000 MW300		IJR-4000 MW300		ACC
	Color	White		White		ACC
	Location	C/S		C/S		ACC
5. Peelable Solder Mask	Material Type
	Thickness
	Location
6. Identification	UL Mark	YES		YES		ACC
	Date Code	WWYY		2121		ACC
	Mark Location	Solder Side		Solder Side		ACC
7. Surface Finish	Method	Immersion Gold		Immersion Gold		ACC
	Tin Thickness
	Nickel Thickness	3-6	µm	4.06	µm	ACC
	Gold Thickness	0.05	µm	0.056	µm	ACC
8. Normativeness	RoHS	Directive 2015/863/EU		OK		ACC
	REACH	Directive 1907 /2006		OK		ACC
9.Annular Ring	Min. Line Width (mil)	5.00	mil	4.80	mil	ACC
	Min. Spacing (mil)	5.00	mil	5.20	mil	ACC
10.V-groove	Angle	30º		30º		ACC
	Residual thickness	0.4	±0.1mm	0.43	mm	ACC
11. Beveling	Angle
	Height
12. Function	Electrical Test	100% PASS		100% PASS		ACC
13. Appearance	IPC Class Level	IPC-A-600J &6012D Class 2		IPC-A-600J &6012D Class 2		ACC
	Visual Inspection	IPC-A-600J &6012D Class 2		IPC-A-600J &6012D Class 2		ACC
	Warp and Twist	≦	0.70%	0.21%		ACC
14. Reliability Test	Tape Test	No Peeling		OK		ACC
	Solvent Test	No Peeling		OK		ACC
	Solderability Test	265 ±5℃		OK		ACC
	Thermal Stress Test	288 ±5℃		OK		ACC
	Ionic Contamination Test	≦ 1.56 µg/c㎡		0.56	µg/c㎡	ACC

Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05

Hole Code	PTH	Required	Actual value				Result
1	Y	0.400	0.400	0.425	0.425	0.400	ACC
2	Y	0.450	0.450	0.500	0.475	0.450	ACC
3	Y	0.600	0.600	0.650	0.625	0.600	ACC
4	Y	0.725	0.750	0.775	0.775	0.750	ACC
5	Y	0.850	0.850	0.825	0.850	0.825	ACC

Electric Test Report

Test Type	Flying Probe	Testing Points	156	Testing Time	5/28/2021	Quantity	1000	Pieces
Testing Condition	Voltage	250V		Conductive Resistance		20 Ω
	Current	100 mA		Isulation Resistance		20 mΩ
Testing Result	Quantity Passed	1000	Pieces	Passing Rate		100%
	Quantity Rejected	0	Pieces
	Open Circuits	0	Pieces	Short Circuits		0		Pieces
	Conductive Non-confirming	0	Pieces	Insulation Non-confirming		0		Pieces

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printed circuit board,

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Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications

MOQ:	1
Price:	USD 2.99-9.99 PER PIECE
Standard Packaging:	Vacuum
Delivery Period:	10 working days
Payment Method:	T/T, Western Union
Supply Capacity:	45000 pieces per month

Detail Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng Technologies Limited

Certification

Model Number

BIC-507-V0.62

Number Of Layers:

Glass Epoxy::

IT-180ATC

Final Foil:

1.0 Oz

Final Height Of PCB::

1.6 Mm ±10%

Surface Finish:

Immersion Gold

Solder Mask Color::

Green

Colour Of Component Legend:

White

Test:

100% Electrical Test Prior Shipment

Minimum Order Quantity:

Price:

USD 2.99-9.99 PER PIECE

Packaging Details:

Vacuum

Delivery Time:

10 working days

Payment Terms:

T/T, Western Union

Supply Ability:

45000 pieces per month

Product Description

Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

Applications

Automotive (Engine room ECU)

Backplanes

Data Storage

Server and Networking

Telecommunications

Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications 0

PCB Parameters

Item	Description	Requirement		Actual		Result
1. Laminate	Material Type	FR-4 IT-180ATC		FR-4 IT-180ATC		ACC
	Tg	170	℃	170	℃	ACC
	Supplier	ITEQ		ITEQ		ACC
	Thickness	1.6	±10% mm	1.63-1.68	mm	ACC
2.Plating thickness	Hole Wall	≥25	µm	26.51	µm	ACC
	Outer copper	35	µm	41.09	µm	ACC
	Inner Copper
3.Solder mask	Material Type	TAIYO/ PSR-2000GT600D		TAIYO/ PSR-2000GT600D		ACC
	Color	Green		Green		ACC
	Rigidity (Pencil Test)	≥4H or above		5H		ACC
	S/M Thickness	≥10	µm	20.11	µm	ACC
	Location	Both Sides		Both Sides		ACC
4. Component Mark	Material Type	TAIYO/ IJR-4000 MW300		IJR-4000 MW300		ACC
	Color	White		White		ACC
	Location	C/S		C/S		ACC
5. Peelable Solder Mask	Material Type
	Thickness
	Location
6. Identification	UL Mark	YES		YES		ACC
	Date Code	WWYY		2121		ACC
	Mark Location	Solder Side		Solder Side		ACC
7. Surface Finish	Method	Immersion Gold		Immersion Gold		ACC
	Tin Thickness
	Nickel Thickness	3-6	µm	4.06	µm	ACC
	Gold Thickness	0.05	µm	0.056	µm	ACC
8. Normativeness	RoHS	Directive 2015/863/EU		OK		ACC
	REACH	Directive 1907 /2006		OK		ACC
9.Annular Ring	Min. Line Width (mil)	5.00	mil	4.80	mil	ACC
	Min. Spacing (mil)	5.00	mil	5.20	mil	ACC
10.V-groove	Angle	30º		30º		ACC
	Residual thickness	0.4	±0.1mm	0.43	mm	ACC
11. Beveling	Angle
	Height
12. Function	Electrical Test	100% PASS		100% PASS		ACC
13. Appearance	IPC Class Level	IPC-A-600J &6012D Class 2		IPC-A-600J &6012D Class 2		ACC
	Visual Inspection	IPC-A-600J &6012D Class 2		IPC-A-600J &6012D Class 2		ACC
	Warp and Twist	≦	0.70%	0.21%		ACC
14. Reliability Test	Tape Test	No Peeling		OK		ACC
	Solvent Test	No Peeling		OK		ACC
	Solderability Test	265 ±5℃		OK		ACC
	Thermal Stress Test	288 ±5℃		OK		ACC
	Ionic Contamination Test	≦ 1.56 µg/c㎡		0.56	µg/c㎡	ACC

Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05

Hole Code	PTH	Required	Actual value				Result
1	Y	0.400	0.400	0.425	0.425	0.400	ACC
2	Y	0.450	0.450	0.500	0.475	0.450	ACC
3	Y	0.600	0.600	0.650	0.625	0.600	ACC
4	Y	0.725	0.750	0.775	0.775	0.750	ACC
5	Y	0.850	0.850	0.825	0.850	0.825	ACC

Electric Test Report

Test Type	Flying Probe	Testing Points	156	Testing Time	5/28/2021	Quantity	1000	Pieces
Testing Condition	Voltage	250V		Conductive Resistance		20 Ω
	Current	100 mA		Isulation Resistance		20 mΩ
Testing Result	Quantity Passed	1000	Pieces	Passing Rate		100%
	Quantity Rejected	0	Pieces
	Open Circuits	0	Pieces	Short Circuits		0		Pieces
	Conductive Non-confirming	0	Pieces	Insulation Non-confirming		0		Pieces

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