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F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers
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F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers
  • name

F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers

Detail Information
Product Description
Detail Information
Product Description

F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This PCB features a size of 100 x 100 mm and is designed as a double-sided board with two layers. It supports surface mount components while excluding through-hole components. The layer stackup consists of a top layer made of 35 µm (1 oz) copper starting with 0.5oz plating, paired with a robust F4BME220 core material of 1.0 mm thickness, and a matching 35 µm (1 oz) copper bottom layer. The surface finish is OSP (Organic Solderability Preservative), ensuring reliable soldering performance. Notably, this PCB does not have a solder mask applied.

 

Here are the details in table below.

 

PCB Specifications

PCB SIZE 100 x 100mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35um(0.5 oz +plate) TOP layer
F4BME220 1.0mm
copper ------- 35um(0.5 oz + plate) BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 10 mil / 10 mil
Minimum / Maximum Holes: 0.4 mm / 0.4 mm
Number of Different Holes: 1
Number of Drill Holes: 1
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: F4BME220 DK 2.2
Final foil external: 1oz
Final foil internal: N/A
Final height of PCB: 1.1 mm ±10%
PLATING AND COATING  
Surface Finish OSP
Solder Mask Apply To: no
Solder Mask Color: no
Solder Mask Type: no
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend NO
Colour of Component Legend NO
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Non-Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers 0

 

F4BME High Frequency Laminates

F4BME series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.

 

Features

◆ DK2.17 ～ 3.0 is optional, and DK can be customized

◆ Low loss

◆ F4BME with RTF copper foil has excellent PIM index

◆ Diversified size and cost saving

◆ Irradiation resistance and low exhaust

◆ Commercialization, mass production and high cost performance

 

Typical Applications

◆ Microwave, RF, radar

◆ Phase shifter, passive components

◆ Power divider, coupler and combiner

◆ Feed network, phased array antenna

◆ Satellite communication, base station antenna

 

Our PCB Capability(F4BME)

PCB Material: PTFE glass fiber cloth copper clad laminates
Designation (F4BME ) F4BME DK (10GHz) DF (10 GHz)
F4BME217 2.17±0.04 0.0010
F4BME220 2.20±0.04 0.0010
F4BME233 2.33±0.04 0.0011
F4BME245 2.45±0.05 0.0012
F4BME255 2.55±0.05 0.0013
F4BME265 2.65±0.05 0.0013
F4BME275 2.75±0.05 0.0015
F4BME294 2.94±0.06 0.0016
F4BME300 3.00±0.06 0.0017
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness) 0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 


Data Sheets (F4BME)

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BME217 F4BME220 F4BME233 F4BME245 F4BME255 F4BME265 F4BME275 F4BME294 F4BME300
Dielectric Constant (Typical) 10GHz / 2.17 2.2 2.33 2.45 2.55 2.65 2.75 2.94 3.0
Dielectric Constant Tolerance / / ±0.04 ±0.04 ±0.04 ±0.05 ±0.05 ±0.05 ±0.05 ±0.06 ±0.06
Loss Tangent (Typical) 10GHz / 0.001 0.001 0.0011 0.0012 0.0013 0.0013 0.0015 0.0016 0.0017
20GHz / 0.0014 0.0014 0.0015 0.0017 0.0018 0.0019 0.0021 0.0023 0.0025
Dielectric Constant Temperature Coefficient -55ºC～150ºC PPM/℃ -150 -142 -130 -120 -110 -100 -92 -85 -80
Peel Strength 1 OZ F4BM N/mm >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8
1 OZ F4BME N/mm >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6
Surface Resistivity Standard Condition MΩ ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >23 >23 >23 >25 >25 >25 >28 >30 >30
Breakdown Voltage (XY direction) 5KW,500V/s KV >30 >30 >32 >32 >34 >34 >35 >36 >36
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 25, 34 25, 34 22, 30 20, 25 16, 21 14, 17 14, 16 12, 15 12, 15
Z direction -55 º~288ºC ppm/ºC 240 240 205 187 173 142 112 98 95
Thermal Stress 260℃, 10s,3 times No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08
Density Room Temperature g/cm3 2.17 2.18 2.20 2.22 2.25 2.25 2.28 2.29 2.29
Long-Term Operating Temperature High-Low Temperature Chamber ℃ -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260
Thermal Conductivity Z direction W/(M.K) 0.24 0.24 0.28 0.30 0.33 0.36 0.38 0.41 0.42
PIM Only applicable to F4BME dBc ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159
Flammability / UL-94 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0
Material Composition / / PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

 

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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB

F4B SERIES PCBS
F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers
  • name
F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers
Detail Information
Product Description
Detail Information
Product Description

F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This PCB features a size of 100 x 100 mm and is designed as a double-sided board with two layers. It supports surface mount components while excluding through-hole components. The layer stackup consists of a top layer made of 35 µm (1 oz) copper starting with 0.5oz plating, paired with a robust F4BME220 core material of 1.0 mm thickness, and a matching 35 µm (1 oz) copper bottom layer. The surface finish is OSP (Organic Solderability Preservative), ensuring reliable soldering performance. Notably, this PCB does not have a solder mask applied.

 

Here are the details in table below.

 

PCB Specifications

PCB SIZE 100 x 100mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35um(0.5 oz +plate) TOP layer
F4BME220 1.0mm
copper ------- 35um(0.5 oz + plate) BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 10 mil / 10 mil
Minimum / Maximum Holes: 0.4 mm / 0.4 mm
Number of Different Holes: 1
Number of Drill Holes: 1
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: F4BME220 DK 2.2
Final foil external: 1oz
Final foil internal: N/A
Final height of PCB: 1.1 mm ±10%
PLATING AND COATING  
Surface Finish OSP
Solder Mask Apply To: no
Solder Mask Color: no
Solder Mask Type: no
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend NO
Colour of Component Legend NO
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Non-Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers 0

 

F4BME High Frequency Laminates

F4BME series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.

 

Features

◆ DK2.17 ～ 3.0 is optional, and DK can be customized

◆ Low loss

◆ F4BME with RTF copper foil has excellent PIM index

◆ Diversified size and cost saving

◆ Irradiation resistance and low exhaust

◆ Commercialization, mass production and high cost performance

 

Typical Applications

◆ Microwave, RF, radar

◆ Phase shifter, passive components

◆ Power divider, coupler and combiner

◆ Feed network, phased array antenna

◆ Satellite communication, base station antenna

 

Our PCB Capability(F4BME)

PCB Material: PTFE glass fiber cloth copper clad laminates
Designation (F4BME ) F4BME DK (10GHz) DF (10 GHz)
F4BME217 2.17±0.04 0.0010
F4BME220 2.20±0.04 0.0010
F4BME233 2.33±0.04 0.0011
F4BME245 2.45±0.05 0.0012
F4BME255 2.55±0.05 0.0013
F4BME265 2.65±0.05 0.0013
F4BME275 2.75±0.05 0.0015
F4BME294 2.94±0.06 0.0016
F4BME300 3.00±0.06 0.0017
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness) 0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 


Data Sheets (F4BME)

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BME217 F4BME220 F4BME233 F4BME245 F4BME255 F4BME265 F4BME275 F4BME294 F4BME300
Dielectric Constant (Typical) 10GHz / 2.17 2.2 2.33 2.45 2.55 2.65 2.75 2.94 3.0
Dielectric Constant Tolerance / / ±0.04 ±0.04 ±0.04 ±0.05 ±0.05 ±0.05 ±0.05 ±0.06 ±0.06
Loss Tangent (Typical) 10GHz / 0.001 0.001 0.0011 0.0012 0.0013 0.0013 0.0015 0.0016 0.0017
20GHz / 0.0014 0.0014 0.0015 0.0017 0.0018 0.0019 0.0021 0.0023 0.0025
Dielectric Constant Temperature Coefficient -55ºC～150ºC PPM/℃ -150 -142 -130 -120 -110 -100 -92 -85 -80
Peel Strength 1 OZ F4BM N/mm >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8
1 OZ F4BME N/mm >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6
Surface Resistivity Standard Condition MΩ ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >23 >23 >23 >25 >25 >25 >28 >30 >30
Breakdown Voltage (XY direction) 5KW,500V/s KV >30 >30 >32 >32 >34 >34 >35 >36 >36
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 25, 34 25, 34 22, 30 20, 25 16, 21 14, 17 14, 16 12, 15 12, 15
Z direction -55 º~288ºC ppm/ºC 240 240 205 187 173 142 112 98 95
Thermal Stress 260℃, 10s,3 times No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08
Density Room Temperature g/cm3 2.17 2.18 2.20 2.22 2.25 2.25 2.28 2.29 2.29
Long-Term Operating Temperature High-Low Temperature Chamber ℃ -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260
Thermal Conductivity Z direction W/(M.K) 0.24 0.24 0.28 0.30 0.33 0.36 0.38 0.41 0.42
PIM Only applicable to F4BME dBc ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159
Flammability / UL-94 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0
Material Composition / / PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

 

Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel: 86-755-27374847
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