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Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

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Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

MOQ:	1
Price:	USD 9.99-99.99 per piece
Standard Packaging:	Vacuum
Delivery Period:	10 working days
Payment Method:	T/T, Paypal
Supply Capacity:	45000 pieces per month

Detail Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng Technologies Limited

Certification

Model Number

BIC-508-V3.2

Number Of Layers:

Glass Epoxy:

TU-883

Final Foil External:

1.0oz

Final Height Of PCB:

0.4mm ±0.1

Surface Finish:

Immersion Gold (16.5%) 2 Micoinch Over 100 Microinch Nickel

Solder Mask Color:

Green

Colour Of Component Legend:

White

Test:

100% Electrical Test Prior Shipment

Minimum Order Quantity:

Price:

USD 9.99-99.99 per piece

Packaging Details:

Vacuum

Delivery Time:

10 working days

Payment Terms:

T/T, Paypal

Supply Ability:

45000 pieces per month

Product Description

Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

ThunderClad 2 ( TU-883 ) is a very low loss category material based on a high performance resin. This material is reinforced with regular woven E-glass and designed with very low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 2 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 2 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.

Applications

Radio frequency

Backplane, High performance computing

Line cards, Storage

Servers, Telecom, Base station, Office Routers

Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB 0

Performance and Processing Advantages

Excellent electrical properties

Dielectric constant less than 4.0

Dissipation factor less than 0.005

Stable and flat Dk/Df performance over frequency and temperature

Compatible with modified FR-4 processes

Excellent moisture resistance and Lead Free reflow process compatible

Improved z-axis thermal expansion

Anti-CAF capability

Excellent through-hole and soldering reliability

Halogen Free

Our PCB Capabilities (TU-883)

PCB Material:	High Temperature Resin
Designation:	TU-883
Dielectric constant:	3.60 at 1GHz
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness:	0.5mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology:	HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

Typical Properties of TU-883

	Typical Values	Test Condition	SPEC
Thermal
Tg (DMA)	220 °C
Tg (TMA)	170 °C	E-2/105+des	N/A
Td (TGA)	420 °C
CTE z-axis α1	35 ppm/°C	Pre-Tg	< 60 ppm/°C
CTE z-axis α2	240 ppm/°C	Post-Tg	< 300 ppm/°C
CTE z-axis	2.50%	50 to 260°C	< 3.0%
Thermal Stress, Solder Float, 288°C	> 60 sec	A	> 10 sec
T-260	> 60 min		> 30 min
T-288	> 60 min	E-2/105+des	> 15 min
T-300	> 60 min
Flammability	94V-0	E-24/125+des	94V-0
Electrical
Permittivity (RC63%)
1GHz (SPC method)	3.60
5GHz (SPC method)	3.58	C-24/23/50	N/A
10GHz (SPC method)	3.57
Loss Tangent (RC63%)
1GHz (SPC method)	0.0030
5GHz (SPC method)	0.0037	C-24/23/50	N/A
10GHz (SPC method)	0.0046
Volume Resistivity	> 1010 MΩ•cm	C-96/35/90	> 106 MΩ•cm
Surface Resistivity	> 108 MΩ	C-96/35/90	> 104 MΩ
Electric Strength	> 40 KV/mm	-	> 30 KV/mm
Dielectric Breakdown Voltage	> 50 KV	-	> 40 KV
Mechanical
Young’s Modulus
Warp Direction	28 GPa	A	N/A
Fill Direction	26 GPa
Flexural Strength
Lengthwise	> 60,000 psi	A	> 60,000 psi
Crosswise	> 50,000 psi	A	> 50,000 psi
Peel Strength, 1.0 oz. Cu foil	4~6 lb/in	A	> 4 lb/in
Water Absorption	0.08%	E-1/105+des+D-24/23	< 0.8 %

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