Hybrid PCB on RO4003C and S1000-2 6-layer rigid PCB with 1oz copper weight | and ENIG :Matt Green|Matt Green

Utilizing RO4003C and S1000-2 Materials for Hybrid PCBs

Rogers RO4003C materials and Shengyi's S1000-2 materials are commonly used in the construction of hybrid PCBs. RO4003C is a proprietary woven glass reinforced hydrocarbon/ceramic material known for its excellent electrical performance and low loss tangent. It offers tight control on dielectric constant (Dk) and has a low Z-axis coefficient of thermal expansion. S1000-2, on the other hand, is an epoxy glass (FR-4) laminate with high thermal resistance and low Z-axis CTE. These materials are combined to achieve a balance between high-frequency performance and cost-effectiveness in PCB designs.

Features of RO4003C: Key Characteristics of RO4003C Material

RO4003C boasts a dielectric constant (Dk) of 3.38 +/- 0.05, making it ideal for high-frequency applications. It also has a low dissipation factor of 0.0027 at 10 GHz, indicating minimal signal loss. Additionally, the material exhibits a low Z-axis coefficient of thermal expansion at 46 ppm/°C. These features contribute to its suitability for RF and microwave applications in hybrid PCB designs.

Features of S1000-2: Notable Properties of S1000-2 Material

S1000-2, an epoxy glass (FR-4) laminate, offers several advantageous features for PCB designs. It is lead-free compatible and has a high glass transition temperature (Tg) of 170℃, making it resistant to high temperatures. The material also has a low Z-axis coefficient of thermal expansion of 45 ppm/℃ before Tg, ensuring dimensional stability. S1000-2 exhibits excellent through-hole reliability and anti-CAF performance, making it a reliable choice for various PCB applications.

Hybrid PCB: Combining RO4003C and S1000-2 for Optimal Performance
Hybrid PCBs are designed to leverage the benefits of different materials to meet specific requirements. By using a combination of RO4003C and S1000-2, designers can achieve a balance between high-frequency performance and cost-effectiveness. RO4003C, known for its excellent electrical performance and stable dielectric properties, is typically used in areas or layers where high-frequency performance is critical. S1000-2, on the other hand, is used for other areas of the PCB where high-frequency performance is not as crucial, allowing for cost-effective integration of components and signals.

PCB Stack-up: Constructing a 6-Layer Rigid PCB with RO4003C and S1000-2
The stack-up of the hybrid PCB consists of alternating layers of copper and the two materials. The core layers are made of RO4003C and S1000-2 with specific thicknesses. Copper layers are added on either side of the core layers, and prepreg layers are used for bonding. This 6-layer stack-up provides the necessary electrical and mechanical properties for the PCB design.

PCB Construction details: Specifications and Finishing Touches
The hybrid PCB has specific dimensions, minimum trace/space, and hole size to meet the design requirements. It has a finished board thickness of 1.1mm and a copper weight of 1oz (1.4 mils) per layer. The PCB undergoes via plating and is finished with immersion gold for optimal conductivity and protection. The silkscreen and solder mask colors are chosen accordingly for identification and insulation purposes. Additionally, the PCB is subjected to a thorough electrical test before shipment to ensure its quality.

PCB Statistics: Quantifying the Design Components
The hybrid PCB design incorporates a total of 57 components, including 41 thru-hole pads and 24 top SMT pads. There are 76 vias and 6 nets, highlighting the complexity and connectivity of the design.

Type of artwork supplied: Gerber RS-274-X Format
The artwork for the hybrid PCB is provided in Gerber RS-274-X format, which is a standard format used in the electronics industry for PCB fabrication.

Quality standard: Meeting the IPC-Class-2 Standard
The hybrid PCB adheres to the IPC-Class-2 quality standard, ensuring that it meets the industry's requirements for performance and reliability.

Availability: Hybrid PCBs with RO4003C and S1000-2 Worldwide
These hybrid PCBs, utilizing RO4003C and S1000-2 materials, are widely available worldwide, making them accessible for various electronic applications.

Some Typical Applications: Harnessing the Potential of Hybrid PCBs

• Hybrid PCBs find application in various industries. They are commonly used in point-to-point digital radio antennas, cellular base station equipment, RF identification tags, automotive radar and sensors, as well as LNBs for direct broadcast satellites.Utilizing RO4003C and S1000-2 Materials for Hybrid PCBs
• RO4003C: Excellent electrical performance and low Z-axis coefficient of thermal expansion.
• S1000-2: Lead-free compatible, high thermal resistance, and low Z-axis coefficient of thermal expansion.
• Achieving a balance between high-frequency performance and cost-effectiveness in hybrid PCBs.
• Construction of a 6-layer rigid PCB stack-up with alternating layers of copper, RO4003C, and S1000-2.
• Specifications of the PCB, including dimensions, trace/space, hole size, thickness, copper weight, and surface finish.
• Statistical information on the components, pads, vias, and nets on the PCB.
• Artwork supplied in Gerber RS-274-X format and adherence to IPC-Class-2 quality standard.
• Availability of hybrid PCBs with RO4003C and S1000-2 worldwide.
• Typical applications of hybrid PCBs, including digital radio antennas, cellular base station equipment, RF identification tags, automotive radar, and LNBs for direct broadcast satellites.

In conclusion, hybrid PCBs that combine RO4003C and S1000-2 materials offer a practical solution for achieving high-frequency performance while maintaining cost-effectiveness. The integration of these materials allows for the design and incorporation of high-frequency components and signals, making them suitable for a range of applications in the electronics industry.