Discover the Advanced RO3006 2-Layer PCB with ENIG Finish: Designed for High-Frequency Applications

We’re proud to introduce our latest innovation: the RO3006 2-layer PCB with ENIG finish. This high-performance PCB has been carefully crafted to meet the exacting requirements of RF and microwave applications. Built with Rogers RO3006 laminates and featuring a reliable Electroless Nickel Immersion Gold (ENIG) surface finish, this PCB delivers exceptional performance in environments where precision and stability are critical.

In this article, we’ll explore the design, construction, features, and benefits of this advanced PCB while highlighting its suitability for a wide range of applications.

Precision Construction for Maximum Performance

The construction of the RO3006 PCB has been meticulously designed to ensure exceptional reliability and efficiency. Every detail has been optimized to meet the highest industry standards:

Base Material: Rogers RO3006 ceramic-filled PTFE laminate, chosen for its high-frequency stability.

Layer Count: A 2-layer design offering simplicity and performance.

Board Dimensions: 76 mm x 52 mm, compact and efficient for various applications.

Trace/Space: Minimum 5/4 mils, ideal for high-density designs.

Hole Size: Minimum 0.35 mm, suitable for standard components.

Finished Thickness: 0.71 mm, balancing durability and a lightweight structure.

Copper Weight: 1 oz (1.4 mils) on outer layers for excellent conductivity.

Via Plating Thickness: 20 μm, ensuring strong, reliable interconnections.

Surface Finish: ENIG, providing exceptional solderability and corrosion resistance.

Top Solder Mask: Green for a clean and protective finish, with no solder mask on the bottom side.

Silkscreen: White on the top layer for clear labeling; none on the bottom.

Electrical Testing: Each PCB undergoes 100% electrical testing to ensure defect-free performance before shipment.

Optimized PCB Stackup

The stackup of this PCB has been carefully engineered to deliver superior electrical and mechanical performance. The structure includes:

Copper Layer 1: 35 μm thick for robust signal transmission.

Rogers RO3006 Substrate: 25 mil (0.635 mm) core thickness, providing excellent dielectric stability.

Copper Layer 2: 35 μm thick for dependable grounding and power distribution.

This straightforward yet effective design minimizes signal loss while ensuring long-term reliability.

Technical Overview of the PCB

The design of this PCB has been optimized for simplicity and functionality, as reflected in its key statistics:

Components: 12.

Total Pads: 32.

Thru-Hole Pads: 14.

Top SMT Pads: 18.

Bottom SMT Pads: 0.

Vias: 21.

Nets: 2.

Additionally, the PCB complies with IPC-Class-2 standards, ensuring global manufacturing consistency and reliability. Gerber RS-274-X artwork has been used for compatibility with standard manufacturing processes.

Why Rogers RO3006 Was Selected

The RO3006 laminate has been specifically chosen for this PCB because of its reputation as one of the best materials for high-frequency applications. This ceramic-filled PTFE composite offers exceptional electrical and mechanical properties, making it ideal for RF and microwave systems.

Key Properties of Rogers RO3006

Dielectric Constant (Dk): 6.15 ± 0.15 at 10 GHz/23°C, ensuring stable performance.

Dissipation Factor: 0.002 at 10 GHz, minimizing signal loss.

Thermal Decomposition Temperature (Td): Over 500°C, offering excellent thermal resistance.

Thermal Conductivity: 0.79 W/mK for efficient heat dissipation.

Moisture Absorption: 0.02%, ensuring reliable performance in humid or outdoor environments.

Coefficient of Thermal Expansion (CTE):

X-axis: 17 ppm/°C.

Y-axis: 17 ppm/°C.

Z-axis: 24 ppm/°C.

These properties make the RO3006 laminate a trusted choice for engineers and designers working on high-frequency systems where precision is critical.

Features That Set This PCB Apart

High-Frequency Stability:

The RO3006 substrate ensures a stable dielectric constant, making this PCB ideal for RF and microwave applications.

ENIG Surface Finish:

The ENIG finish provides a smooth, durable surface that enhances solderability, corrosion resistance, and compatibility with fine-pitch components.

Compact, High-Density Design:

A minimum trace/space of 5/4 mils allows for compact layouts and efficient use of board space.

Durable and Reliable:

1 oz copper layers and 20 μm via plating thickness contribute to long-lasting mechanical stability.

Environmental Resistance:

Low moisture absorption and excellent thermal performance ensure reliability in harsh environments.

Global Compliance:

Manufactured to IPC-Class-2 standards, ensuring quality and compatibility across industries.

Benefits of the RO3006 PCB

This PCB offers significant advantages that make it a top choice for high-frequency applications:

Consistent Performance:

The stable dielectric constant ensures reliable operation across a wide range of frequencies and temperatures.

Seamless Assembly:

The low in-plane expansion coefficient aligns well with copper, making it compatible with surface-mounted assemblies.

Cost-Effectiveness:

The material’s compatibility with volume manufacturing processes keeps costs competitive.

Flexibility for Design:

The laminate’s properties make it suitable for hybrid multilayer boards, providing flexibility for advanced designs.

Reliability in Harsh Conditions:

High thermal conductivity and minimal moisture absorption ensure consistent performance in even the toughest environments.

Applications Where This PCB Excels

The versatility of this PCB makes it a valuable solution across various industries. It is particularly well-suited for applications such as:

Automotive Radar Systems: Ideal for 77 GHz radar technologies used in advanced driver assistance systems (ADAS).

GPS Antennas: Ensures precise and reliable positioning for navigation systems.

Telecommunications: Perfect for power amplifiers, antennas, and other RF components in cellular networks.

Satellite Systems: Supports direct broadcast satellites and datalink systems for seamless communication.

IoT Devices: Compact and reliable for remote meter readers and other IoT applications.

Power Backplanes: Ensures dependable performance in high-power electronic systems.

Conclusion

The RO3006 2-layer PCB with ENIG finish is a testament to innovation and quality in PCB design. Its combination of Rogers RO3006 laminate, a robust 2-layer structure, and a reliable ENIG finish makes it ideal for industries requiring high-frequency stability, mechanical strength, and environmental resistance.

This PCB is more than just a product—it’s a solution engineered to meet your most demanding requirements. Whether for automotive, telecommunications, IoT, or satellite systems, it’s designed to deliver reliable performance.

To learn more about this PCB or discuss how it can fit your project needs, feel free to contact us today. Let’s help you bring your designs to life!