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Why more engineers are choosing OSP finish for F4BTMS1000 high-frequency PCB designs
  • name

Why more engineers are choosing OSP finish for F4BTMS1000 high-frequency PCB designs

Detail Information
Product Description
Detail Information
Product Description
F4BTMS1000 High-Frequency PCB – Engineered for RF & Aerospace Applications
 
Overview
The F4BTMS1000 is a high-performance, 2-layer rigid PCB designed for demanding RF, microwave, and aerospace applications. Constructed with advanced F4BTMS1000 ceramic-filled PTFE material, this PCB is characterized by exceptional electrical stability, ultra-low loss, and superior thermal management—making it well-suited for phase-sensitive antennas, radar systems, and satellite communications.
 
 
 
Key Features & Benefits
✅ Ultra-Low Signal Loss
  • A dielectric constant (Dk) of 10.2 @ 10GHz is achieved, along with a dissipation factor (Df) of 0.0020 @ 10GHz (0.0023 @ 20GHz).
  • RTF low-roughness copper foil is used to minimize conductor loss while ensuring strong peel strength.
 
✅ High Thermal & Dimensional Stability
  • Thermal conductivity is measured at 0.81 W/mK, enabling efficient heat dissipation.
  • Low CTE values are maintained, with X/Y/Z coefficients of 16/18/32 ppm/°C (–55°C to 288°C), reducing warping under thermal stress.
  • Moisture absorption is limited to just 0.03%, ensuring reliability in harsh environments.
 
✅ Aerospace-Grade Material
  • The material is reinforced with nano-ceramics and ultra-fine glass fiber, minimizing dielectric anisotropy and enhancing signal integrity.
  • Stable dielectric properties are maintained across a wide temperature range (–55°C to 150°C), supported by a thermal Dk coefficient of –320 ppm/°C.
 
✅ Precision Manufacturing
  • 4/4 mil trace/space, 0.3mm minimum hole size, and 20μm via plating are supported for high-density designs.
  • OSP surface finish is applied for solderability without masking/silkscreen (ensuring clean RF performance).
  • 100% electrical testing is conducted (per IPC-Class-2 standards).
 
Technical Specifications
Parameter Details
  1. Base Material: F4BTMS1000 (Ceramic-PTFE Composite)
  2. Layers: 2
  3. Dimensions: 85mm x 40mm (±0.15mm)
  4. Thickness: 0.6mm (0.508mm core + 35μm Cu layers)
  5. Surface Finish: OSP (No solder mask/silkscreen)
  6. Artwork Format: Gerber RS-274-X
 
 
Advantages of the F4BTMS1000 PCB
  1. Imported Substrates Can Be Replaced: Comparable performance to high-end foreign RF materials is offered at a competitive cost.
  2. Optimized for High-Frequency: Minimal dispersion and loss are ensured up to 20GHz+.
  3. Reliability is Guaranteed: Compliance with IPC-Class-2 standards is maintained for aerospace and defense applications.
 
 
Typical Applications
 
Tags: 

pcb trace,  

online pcb design,  

bluetooth circuit board

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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB

F4B SERIES PCBS
Why more engineers are choosing OSP finish for F4BTMS1000 high-frequency PCB designs
  • name
Why more engineers are choosing OSP finish for F4BTMS1000 high-frequency PCB designs
Detail Information
Product Description
Detail Information
Product Description
F4BTMS1000 High-Frequency PCB – Engineered for RF & Aerospace Applications
 
Overview
The F4BTMS1000 is a high-performance, 2-layer rigid PCB designed for demanding RF, microwave, and aerospace applications. Constructed with advanced F4BTMS1000 ceramic-filled PTFE material, this PCB is characterized by exceptional electrical stability, ultra-low loss, and superior thermal management—making it well-suited for phase-sensitive antennas, radar systems, and satellite communications.
 
 
 
Key Features & Benefits
✅ Ultra-Low Signal Loss
  • A dielectric constant (Dk) of 10.2 @ 10GHz is achieved, along with a dissipation factor (Df) of 0.0020 @ 10GHz (0.0023 @ 20GHz).
  • RTF low-roughness copper foil is used to minimize conductor loss while ensuring strong peel strength.
 
✅ High Thermal & Dimensional Stability
  • Thermal conductivity is measured at 0.81 W/mK, enabling efficient heat dissipation.
  • Low CTE values are maintained, with X/Y/Z coefficients of 16/18/32 ppm/°C (–55°C to 288°C), reducing warping under thermal stress.
  • Moisture absorption is limited to just 0.03%, ensuring reliability in harsh environments.
 
✅ Aerospace-Grade Material
  • The material is reinforced with nano-ceramics and ultra-fine glass fiber, minimizing dielectric anisotropy and enhancing signal integrity.
  • Stable dielectric properties are maintained across a wide temperature range (–55°C to 150°C), supported by a thermal Dk coefficient of –320 ppm/°C.
 
✅ Precision Manufacturing
  • 4/4 mil trace/space, 0.3mm minimum hole size, and 20μm via plating are supported for high-density designs.
  • OSP surface finish is applied for solderability without masking/silkscreen (ensuring clean RF performance).
  • 100% electrical testing is conducted (per IPC-Class-2 standards).
 
Technical Specifications
Parameter Details
  1. Base Material: F4BTMS1000 (Ceramic-PTFE Composite)
  2. Layers: 2
  3. Dimensions: 85mm x 40mm (±0.15mm)
  4. Thickness: 0.6mm (0.508mm core + 35μm Cu layers)
  5. Surface Finish: OSP (No solder mask/silkscreen)
  6. Artwork Format: Gerber RS-274-X
 
 
Advantages of the F4BTMS1000 PCB
  1. Imported Substrates Can Be Replaced: Comparable performance to high-end foreign RF materials is offered at a competitive cost.
  2. Optimized for High-Frequency: Minimal dispersion and loss are ensured up to 20GHz+.
  3. Reliability is Guaranteed: Compliance with IPC-Class-2 standards is maintained for aerospace and defense applications.
 
 
Typical Applications
 
Tags: 

pcb trace,

online pcb design,

bluetooth circuit board

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