Unleashing the Power of RO4533 PCBs in Antenna Technology
Introduction:
Step into the world of advanced antenna technology, where innovation and performance reign supreme. Amidst this landscape of cutting-edge solutions, Rogers RO4533 laminates shine as a beacon of excellence, offering exceptional dielectric properties, low loss performance, and impeccable passive intermodulation response tailored for microstrip antenna applications.
Q: What makes RO4533 laminates stand out in the field of antenna technology?
A: RO4533 laminates feature a unique blend of ceramic-filled, glass-reinforced hydrocarbon-based materials that deliver superior dielectric properties and low loss performance, making them a preferred choice for mobile infrastructure antenna applications.
Q: What are the standout features of RO4533 laminates?
A: RO4533 boasts a dielectric constant of DK 3.3 at 10GHz, a dissipation factor of 0.0025 at the same frequency, and a thermoset resin system that ensures low loss, low Dk, and low PIM response for a wide range of applications.
Q: How are RO4533 PCBs engineered for optimal performance?
A: The RO4533 PCB stackup consists of carefully crafted copper layers with precise thicknesses, a Rogers 4533 core at 1.524mm (60mil), and meticulous attention to dimensions, trace/spaces, hole sizes, and finishing details to meet stringent quality and performance standards.
Q: Where can RO4533 PCBs be applied, and what performance metrics highlight their capabilities?
A: RO4533 PCBs find utility in a range of applications, including cellular infrastructure base station antennas and WiMAX antenna networks. Detailed performance metrics on components, pads, vias, and nets underscore their versatility and reliability.
Q: What quality standards do RO4533 PCBs adhere to, and where are they available?
A: RO4533 PCBs conform to IPC-Class-2 quality standards, ensuring consistent performance and reliability. With global availability, they offer a dependable solution for antenna designers and manufacturers seeking top-tier performance.
RO4533 laminates represent a breakthrough in antenna technology, offering unmatched performance and reliability. As the industry evolves and demands excellence, RO4533 stands poised to redefine the possibilities in antenna design and innovation. Embrace the future of antenna technology with RO4533 PCBs, where every connection is engineered for peak performance and every signal resonates with excellence.
Property | RO4533 | Direction | Units | Condition | Test Method |
Dielectric Constant, er Process | 3.3 ± 0.08 | Z | - | 10 GHz/23℃ 2.5 GHz | IPC-TM-650,2.5.5.5 |
Dissipation Factor | 0.002 | Z | - | 2.5 GHz/23℃ | IPC-TM-650, 2.5.5.5 |
0.0025 | 10 GHz/23℃ | ||||
PIM (Typical) | -157 | - | dBc | Reflected 43 dBm swept tones | Summitek 1900b PIM Analyzer |
Dielectric Strength | >500 | Z | V/mil | 0.51 mm | IPC-TM-650, 2.5.6.2 |
Dimensional Stability | <0.2 | X,Y | mm/m (mils/inch) | after etch | IPC-TM-650, 2.4.39A |
Coefficient of Thermal Expansion | 13 | X | ppm/℃ | -55 to 288℃ | IPC-TM-650, 2.4.41 |
11 | Y | ||||
37 | Z | ||||
Thermal Conductivity | 0.6 | - | W/(m.K) | 80℃ | ASTM C518 |
Moisture Absorption | 0.02 | - | % | D48/50 | IPC-TM-650, 2.6.2.1 ASTM D570 |
Tg | >280 | - | ℃ TMA | A | IPC-TM-650, 2.4.24.3 |
Density | 1.8 | - | gm/cm3 | - | ASTM D792 |
Copper Peel Strength | 6.9 (1.2) | - | lbs/in (N/mm) | 1 oz. EDC post solder float | IPC-TM-650, 2.4.8 |
Flammability | NON FR | - | - | - | UL 94 |
Lead-Free Process Compatible | Yes | - | - | - | - |
Unleashing the Power of RO4533 PCBs in Antenna Technology
Introduction:
Step into the world of advanced antenna technology, where innovation and performance reign supreme. Amidst this landscape of cutting-edge solutions, Rogers RO4533 laminates shine as a beacon of excellence, offering exceptional dielectric properties, low loss performance, and impeccable passive intermodulation response tailored for microstrip antenna applications.
Q: What makes RO4533 laminates stand out in the field of antenna technology?
A: RO4533 laminates feature a unique blend of ceramic-filled, glass-reinforced hydrocarbon-based materials that deliver superior dielectric properties and low loss performance, making them a preferred choice for mobile infrastructure antenna applications.
Q: What are the standout features of RO4533 laminates?
A: RO4533 boasts a dielectric constant of DK 3.3 at 10GHz, a dissipation factor of 0.0025 at the same frequency, and a thermoset resin system that ensures low loss, low Dk, and low PIM response for a wide range of applications.
Q: How are RO4533 PCBs engineered for optimal performance?
A: The RO4533 PCB stackup consists of carefully crafted copper layers with precise thicknesses, a Rogers 4533 core at 1.524mm (60mil), and meticulous attention to dimensions, trace/spaces, hole sizes, and finishing details to meet stringent quality and performance standards.
Q: Where can RO4533 PCBs be applied, and what performance metrics highlight their capabilities?
A: RO4533 PCBs find utility in a range of applications, including cellular infrastructure base station antennas and WiMAX antenna networks. Detailed performance metrics on components, pads, vias, and nets underscore their versatility and reliability.
Q: What quality standards do RO4533 PCBs adhere to, and where are they available?
A: RO4533 PCBs conform to IPC-Class-2 quality standards, ensuring consistent performance and reliability. With global availability, they offer a dependable solution for antenna designers and manufacturers seeking top-tier performance.
RO4533 laminates represent a breakthrough in antenna technology, offering unmatched performance and reliability. As the industry evolves and demands excellence, RO4533 stands poised to redefine the possibilities in antenna design and innovation. Embrace the future of antenna technology with RO4533 PCBs, where every connection is engineered for peak performance and every signal resonates with excellence.
Property | RO4533 | Direction | Units | Condition | Test Method |
Dielectric Constant, er Process | 3.3 ± 0.08 | Z | - | 10 GHz/23℃ 2.5 GHz | IPC-TM-650,2.5.5.5 |
Dissipation Factor | 0.002 | Z | - | 2.5 GHz/23℃ | IPC-TM-650, 2.5.5.5 |
0.0025 | 10 GHz/23℃ | ||||
PIM (Typical) | -157 | - | dBc | Reflected 43 dBm swept tones | Summitek 1900b PIM Analyzer |
Dielectric Strength | >500 | Z | V/mil | 0.51 mm | IPC-TM-650, 2.5.6.2 |
Dimensional Stability | <0.2 | X,Y | mm/m (mils/inch) | after etch | IPC-TM-650, 2.4.39A |
Coefficient of Thermal Expansion | 13 | X | ppm/℃ | -55 to 288℃ | IPC-TM-650, 2.4.41 |
11 | Y | ||||
37 | Z | ||||
Thermal Conductivity | 0.6 | - | W/(m.K) | 80℃ | ASTM C518 |
Moisture Absorption | 0.02 | - | % | D48/50 | IPC-TM-650, 2.6.2.1 ASTM D570 |
Tg | >280 | - | ℃ TMA | A | IPC-TM-650, 2.4.24.3 |
Density | 1.8 | - | gm/cm3 | - | ASTM D792 |
Copper Peel Strength | 6.9 (1.2) | - | lbs/in (N/mm) | 1 oz. EDC post solder float | IPC-TM-650, 2.4.8 |
Flammability | NON FR | - | - | - | UL 94 |
Lead-Free Process Compatible | Yes | - | - | - | - |